If you are interested in modeling a variety of electromechanical sensors, then tune into this webinar to learn how OnScale helps Fortune100 companies optimize their most demanding designs using powerful FEM seamlessly integrated with Cloud HPC directly with on-demand, scalable Cloud HPC.
Understanding the complex, highly coupled behavior of electromechanical sensors (e.g. MUTs, piezoelectric transducer arrays, BAWs and SAWs) and their performance in a system as a whole is critical in the development of innovative technologies (e.g. Ultrasonic Fingerprint Sensors, Medical Imaging, and RF Filters).
Due to the anisotropic materials, complex modal coupling, and multiphysics involved in a single design (piezoelectric, electrostatic, structural, thermal and acoustic), powerful numerical simulation is essential for predicting and understanding effects of design changes, environmental influences, and manufacturing tolerances. By facilitating rapid design iteration and assessment, cloud based simulation tools can explore large design spaces that would be impossible to do via physical prototypes.
In this webinar, OnScale will explore and analyze some of the common pain-problems in the senor space, and present pragmatic examples to show how rapid FEM & Cloud HPC can dramatically accelerate product design cycles, reducing time, cost and risk.
Gerry Harvey, VP of Engineering, OnScale
Dr. Harvey is a numerical scientist and engineer with 15 years of experience applying FEA/FEM approaches to complex engineering problems. An acoustics expert, Dr. Harvey supports hundreds of RF filter engineers who use OnScale every day for filter design optimization.
Andrew Tweedie, UK Director, OnScale
Dr. Tweedie is a multi-disciplined engineer with 15 years of experience in Finite Element simulation of piezoelectric devices. Dr. Tweedie supports UK and EU customers while simultaneously managing the development center in Glasgow, Scotland.
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